Q&A J-STD-020E/033D

Owned by Nico Mäding
Last updated: 2019-03-19

The area array surface mount package device complies with the latest JEDEC standards:

Note: Both JEDEC documents can be downloaded free of charge after registration at https://www.jedec.org/user/register.

Table of contents:

144-pin BGA package dimension

Source: netX 90 TRG


Reflow sensitivity classification

Profile FeaturePb-Free Assembly

Preheat/Soak
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (ts) from (Tsmin to Tsmax)


150 °C
200 °C
60-120 seconds
Ramp-up rate (TL to Tp)3 °C/second max.

Liquidous temperature (TL)
Time (tL) maintained above TL

217 °C
60-150 seconds

Peak package body temperature (Tp)260 °C

Time (tp)* within 5 °C of the specified classification temperature (Tc), see Figure

30* seconds
Ramp-down rate (Tp to TL)6 °C/second max.
Time 25 °C to peak temperature8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. For example, if Tc is 260 °C and time tp is 30 seconds, this means the following for the supplier and the user:

  • For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
  • For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.

Source: J-STD-020E


Moisture sensitivity classification

The moisture sensitivity classification is moisture sensitivity level 3 (MSL 3): 168 hours, ≤ 30 °C / 60 % RH (moisture soak level 3: 192 hours, 30 °C / 60 % RH).

Source: J-STD-020E


Storage, floor life and bake time

The sealed dry packs must be stored at the following conditions:

  • Temperature < 40 °C
  • Relative humidity < 90 %

After opening the dry packs, unpacked components have a floor life of 168 hours, which means they may be stored up to 168 hours (7 days) before soldering at the following conditions:

  • Temperature ≤ 30 °C
  • Relative humidity ≤ 60 %

By storing unpacked components in a dry cabinet (relative humidity ≤ 10 %), the floor life clock can be stopped.

When exceeding the maximum floor life or the environmental conditions or when the humidity indicator card enclosed with the dry pack indicates a moisture level of >10 % after opening the dry pack, the devices must be dried (baked) prior to soldering, to avoid device damage during the soldering process (cracking or delamination). Baking must be performed at 125 °C for a minimum time of 8 hours or at other applicable conditions, defined by J-STD-033D.

Source: J-STD-033D


Thermal characteristic analysis

See chapter 6.1 Thermal behavior netX 90 Design-In Guide: Downloads netX 90